IEEE Spectrum and Wiley are proud to bring you this White Paper, sponsored by Keysight

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Electronic products now pack circuits, structures, thermal paths, and packaging into very small spaces. These physical domains interact with one another. A packaging choice can change how a shock load reaches a circuit board. Such interactions are hard to predict. Most are found during physical qualification, late in development. At that stage, the design is mostly fixed. A failure leads to redesign, rebuilds, and retesting. Physical tests give strong evidence of robustness, but they give limited insight into load paths and failure margins. Traditional simulation gives more detail, but it needs specialist skills and long manual setup. This white paper explains how guided virtual validation brings shock and drop assessment into the design phase. It reviews common test configurations, model inputs, and acceptance criteria. A packaged drop case study then shows how packaging can be optimized across all drop orientations and checked against physical test results.